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NCV8664C Folha de dados(PDF) 9 Page - ON Semiconductor

Nome de Peças NCV8664C
Descrição Electrónicos  Very Low Iq Low Dropout Linear Regulator
Download  13 Pages
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Fabricante Electrônico  ONSEMI [ON Semiconductor]
Página de início  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV8664C Folha de dados(HTML) 9 Page - ON Semiconductor

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NCV8664C
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Circuit Description
The NCV8664C is a precision trimmed 3.3 V and 5.0 V
fixed output regulator. Careful management of light load
consumption combined with a low leakage process results
in a typical quiescent current of 22
mA. The device has
current capability of 150 mA, with 600 mV of dropout
voltage at full rated load current. The regulation is provided
by a PNP pass transistor controlled by an error amplifier
with a bandgap reference. The regulator is protected by
both current limit and short circuit protection. Thermal
shutdown occurs above 150
°C to protect the IC during
overloads and extreme ambient temperatures.
Regulator
The error amplifier compares the reference voltage to a
sample of the output voltage (Vout) and drives the base of
a PNP series pass transistor by a buffer. The reference is a
bandgap design to give it a temperature−stable output.
Saturation control of the PNP is a function of the load
current and input voltage. Over saturation of the output
power device is prevented, and quiescent current in the
ground pin is minimized. The NCV8664C is equipped with
foldback current protection. This protection is designed to
reduce the current limit during an overcurrent situation.
Regulator Stability Considerations
The input capacitor CIN in Figure 2 is necessary for
compensating input line reactance. Possible oscillations
caused by input inductance and input capacitance can be
damped by using a resistor of approximately 1
W in series
with CIN. The output or compensation capacitor, COUT
helps determine three main characteristics of a linear
regulator: startup delay, load transient response and loop
stability. The capacitor value and type should be based on
cost,
availability, size and temperature constraints.
Tantalum,
aluminum
electrolytic, film, or ceramic
capacitors are all acceptable solutions, however, attention
must be paid to ESR constraints. The aluminum
electrolytic capacitor is the least expensive solution, but, if
the circuit operates at low temperatures (−25
°C to −40°C),
both the value and ESR of the capacitor will vary
considerably. The capacitor manufacturer’s data sheet
usually provides this information. The value for the output
capacitor COUT shown in Figure 2 should work for most
applications; however, it is not necessarily the optimized
solution. Actual Stability Regions are shown in the graphs
in the Typical Performance Characteristics section.
Calculating Power Dissipation in a Single Output
Linear Regulator
The maximum power dissipation for a single output
regulator (Figure 3) is:
IQ(max) ) VI(max) @ Iq
(eq. 1)
PD(max) + [VIN(max) * VOUT(min)] @
Where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IQ(max) is the maximum output current for the
application, and Iq is the quiescent current the regulator
consumes at IQ(max).
Once the value of PD(Max) is known, the maximum
permissible value of RqJA can be calculated:
P
qJA +
150oC
* TA
PD
(eq. 2)
The value of RqJA can then be compared with those in the
package section of the data sheet. Those packages with
RqJA’s less than the calculated value in Equation 2 will keep
the die temperature below 150
°C. In some cases, none of
the packages will be sufficient to dissipate the heat
generated by the IC, and an external heat sink will be
required. The current flow and voltages are shown in the
Measurement Circuit Diagram.
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air. Each material in the heat flow path
between the IC and the outside environment will have a
thermal resistance. Like series electrical resistances, these
resistances are summed to determine the value of RqJA:
R
qJA + RqJC ) RqCS ) RqSA
(eq. 3)
Where:
RqJC = the junction−to−case thermal resistance,
RqCS = the case−to−heat sink thermal resistance, and
RqSA = the heat sink−to−ambient thermal resistance.
RqJC appears in the package section of the data sheet.
Like RqJA, it too is a function of package type. RqCS and
RqSA are functions of the package type, heatsink and the
interface between them. These values appear in data sheets
of heatsink manufacturers.
Thermal, mounting, and heat sinking are discussed in the
ON Semiconductor application note AN1040/D, available
on the ON Semiconductor Website.


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