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EQY-10-24-D Folha de dados(PDF) 2 Page - Mini-Circuits |
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EQY-10-24-D Folha de dados(HTML) 2 Page - Mini-Circuits |
2 / 4 page Page 2 of 4 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com Gain Equalizer Die 50Ω 10dB DC to 20 GHz Microwave Pad Number Function Description 2 RF-IN RF-Input pad 5 RF-OUT RF-Output pad 1,3,4,6 GND Ground Product Features • 10.0 dB Slope • Wide Bandwidth, DC-20 GHz • Excellent Return Loss, 20 dB typ. General Description EQY-10-24-D+ is an absorptive Gain Equalizer Die fabricated using highly repetitive GaAs IPD MMIC process incorporating resistors, capacitors and inductors having negative insertion loss slope. EQY-10-24-D+ has a nominal attenuation slope of 10.0 dB. EQY-10-24-D+ Simplified Schematic and Pad description Bonding Pad Position Dimensions in µm, Typical L1 L2 L3 L4 L5 H1 H2 H3 H4 Thickness Die Size Bond Pad #1, #3, #4, #6 Bond Pad #2, #5 87 99 651 664 750 230 430 630 825 100 750x825 92 X 92 117 X 142 +RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications Ordering Information: Refer to Last Page Typical Applications • Fixed Satellite • Mobile • Radio location • Space research RF-IN RF-OUT REV. OR M171290 EQY-10-24-D+ GY/RS/CP/AM 190123 Bonding Pad Position / Description Die Dimensions in um L1 L2 L3 L4 L5 H1 H2 H3 H4 87 99 651 664 750 230 430 630 825 Thickness Die Size Bond Pad #1, #3, #4, #6 Bond Pad #2, #5 100 750 x 825 92 x 92 117 x 142 Pad # Description 1,3,4,6 Ground 2 Input 5 Output L1 L3 L5 L4 H4 H3 H2 H1 0 L2 3 0 2 4 5 1 6 |
Nº de peça semelhante - EQY-10-24-D |
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Descrição semelhante - EQY-10-24-D |
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