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EMM5081V1B Folha de dados(PDF) 15 Page - Eudyna Devices Inc

Nome de Peças EMM5081V1B
Descrição Electrónicos  Ku-Band Power Amplifier MMIC
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Fabricante Electrônico  EUDYNA [Eudyna Devices Inc]
Página de início  http://www.sei-device.com/index.asp
Logo EUDYNA - Eudyna Devices Inc

EMM5081V1B Folha de dados(HTML) 15 Page - Eudyna Devices Inc

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Edition 2.0
October, 2008
http://www.eudyna.com/
Ku-Band Power Amplifier MMIC
EMM5081V1B
Mounting Method of SMD (Surface Mount Devices) for Lead
Mounting Method of SMD (Surface Mount Devices) for Lead--free Solder
free Solder
Mounting Condition
1. For soldering, Lead-free solder (Sn-3.0Ag-0.5Cu)*1 or equivalent shall be used.
(*1:The figure displays with weight %. A predominantly tin-rich alloy with 3.0% silver and 0.5% copper.)
2. A rosin type flux with a chlorine content of 0.2% or less shall be used. The rosin flux with low halogen
content is recommended.
3. When soldering, use one of the following time/ temperature methods for acceptable solder joints.
Make sure the devices have been properly prepared with flux prior soldering.
* Reflow soldering method (Infrared reflow / Heat circulation reflow / Hot plate reflow):
Limit solder to 3 reflow cycles because resin is used in the modules manufacturing process.
Excessive reflow cycles will effect the resin resulting in a potential failure or latent defect.
The recommended reflow temperature profile is shown below. The temperature of the reflow
profile must be measured at the device lead.
Reflow temperature profile and condition:
(1) Average Ramp-up Rate:
3deg-C/seconds
(2) Preheating:
150 - 200deg-C,
60 - 180seconds
(3) Main heating:
220deg-C,
60seconds max.
(4) Peak Temperature:
260deg-C max., more than 250deg-C, 10 seconds max.
* Measurement point: Device lead.
4. The above-recommended conditions were confirmed using the manufacture’s equipment and materials.
However, when soldering these products, the soldering condition should be verified by customer using
their equipment and materials.
200
220
(4)
(1)
260
250
RT
(2)
(3)
150
Time


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