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EMM5081V1B Folha de dados(PDF) 15 Page - Eudyna Devices Inc |
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EMM5081V1B Folha de dados(HTML) 15 Page - Eudyna Devices Inc |
15 / 16 page 15 Edition 2.0 October, 2008 http://www.eudyna.com/ Ku-Band Power Amplifier MMIC EMM5081V1B Mounting Method of SMD (Surface Mount Devices) for Lead Mounting Method of SMD (Surface Mount Devices) for Lead--free Solder free Solder Mounting Condition 1. For soldering, Lead-free solder (Sn-3.0Ag-0.5Cu)*1 or equivalent shall be used. (*1:The figure displays with weight %. A predominantly tin-rich alloy with 3.0% silver and 0.5% copper.) 2. A rosin type flux with a chlorine content of 0.2% or less shall be used. The rosin flux with low halogen content is recommended. 3. When soldering, use one of the following time/ temperature methods for acceptable solder joints. Make sure the devices have been properly prepared with flux prior soldering. * Reflow soldering method (Infrared reflow / Heat circulation reflow / Hot plate reflow): Limit solder to 3 reflow cycles because resin is used in the modules manufacturing process. Excessive reflow cycles will effect the resin resulting in a potential failure or latent defect. The recommended reflow temperature profile is shown below. The temperature of the reflow profile must be measured at the device lead. Reflow temperature profile and condition: (1) Average Ramp-up Rate: 3deg-C/seconds (2) Preheating: 150 - 200deg-C, 60 - 180seconds (3) Main heating: 220deg-C, 60seconds max. (4) Peak Temperature: 260deg-C max., more than 250deg-C, 10 seconds max. * Measurement point: Device lead. 4. The above-recommended conditions were confirmed using the manufacture’s equipment and materials. However, when soldering these products, the soldering condition should be verified by customer using their equipment and materials. 200 220 (4) (1) 260 250 RT (2) (3) 150 Time |
Nº de peça semelhante - EMM5081V1B |
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Descrição semelhante - EMM5081V1B |
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