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FQD6N50C Folha de dados(PDF) 1 Page - Fairchild Semiconductor

Nome de Peças FQD6N50C
Descrição Electrónicos  These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary planar stripe, DMOS technology
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Fabricante Electrônico  FAIRCHILD [Fairchild Semiconductor]
Página de início  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FQD6N50C Folha de dados(HTML) 1 Page - Fairchild Semiconductor

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©2004 Fairchild Semiconductor Corporation
QFET®
Rev. B, June 2004
FQD6N50C / FQU6N50C
500V N-Channel MOSFET
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
active power factor correction, electronic lamp ballasts
based on half bridge topology.
Features
• 4.5A, 500V, RDS(on) = 1.2 Ω @VGS = 10 V
• Low gate charge (typical 19nC)
• Low Crss (typical 15pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
Absolute Maximum Ratings T
C = 25°C unless otherwise noted
Thermal Characteristics
* When mounted on the minimum pad size recommended (PCB Mount)
Symbol
Parameter
FQD6N50C / FQU6N50C
Units
VDSS
Drain-Source Voltage
500
V
ID
Drain Current
- Continuous (TC = 25°C)
4.5
A
- Continuous (TC = 100°C)
2.7
A
IDM
Drain Current
- Pulsed
(Note 1)
18
A
VGSS
Gate-Source Voltage
± 30
V
EAS
Single Pulsed Avalanche Energy
(Note 2)
300
mJ
IAR
Avalanche Current
(Note 1)
4.5
A
EAR
Repetitive Avalanche Energy
(Note 1)
6.1
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
4.5
V/ns
PD
Power Dissipation (TA = 25°C)*
2.5
W
Power Dissipation (TC = 25°C)
61
W
- Derate above 25°C
0.49
W/°C
TJ, TSTG
Operating and Storage Temperature Range
-55 to +150
°C
TL
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300
°C
Symbol
Parameter
Typ
Max
Units
RθJC
Thermal Resistance, Junction-to-Case
-
2.05
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient *
-
50
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
-
110
°C/W
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S
D
G
I-PAK
FQU Series
D-PAK
FQD Series
GS
D
GS
D


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