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VLMF31Q2T1-GS18 Datasheet(Folha de dados) 5 Page - HK TO-GRACE TECHNOLOGY CO.,LTD.

Nome de Peças. VLMF31Q2T1-GS18
descrição  High Intensity SMD LED PLCC-2
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Fbricantes  TO-GRACE [HK TO-GRACE TECHNOLOGY CO.,LTD.]
Página de início  http://www.to-grace.com/index.html
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VLMF31..
www.vishay.com
Vishay Semiconductors
Rev. 1.7, 07-Mar-18
5
Document Number: 81330
For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
METHOD OF TAPING / POLARITY AND TAPE AND REEL
SMD LED (VLM3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN IEC 40
(CO 564) for automatic component insertation. The blister
tape is a plastic strip with impressed component cavities,
covered by a top tape.
TAPING OF VLM.3..
Fig. 9 - Tape Dimensions in mm for PLCC-2
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS)
Fig. 10 - Reel Dimensions - GS08
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18
(= 8000 PCS) PREFERRED
Fig. 11 - Reel Dimensions - GS18
SOLDERING PROFILE
Fig. 12 - Vishay Lead (Pb)-free Reflow Soldering Profile
(according to J-STD-020C)
Fig. 13 - Double Wave Soldering of Opto Devices (all Packages)
Adhesive tape
Component cavity
Blister tape
94 8670
1.85
1.65
4.0
3.6
3.6
3.4
2.05
1.95
1.6
1.4
4.1
3.9
4.1
3.9
5.75
5.25
8.3
7.7
3.5
3.1
2.2
2.0
0.25
94 8668
180
178
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
14.4 max.
10.0
9.0
120°
94 8665
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
321
329
Identification
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
14.4 max.
10.4
8.4
120°
18857
Label:
Vishay
type
group
tape code
production
code
quantity
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Time (s)
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19885
IR Reflow Soldering Profile for Lead (Pb)-Free Soldering
Preconditioning according to JEDEC level 2a
max. 2 cycles allowed
255 °C
948626-1
10
100
1000
10000
0
100
200
300
0
50
100
150
200
250
TTW Soldering (according to CECC00802)
Time (s)
50
150
250
2 K/s
Second
wave
Wirst wave
5 s
Full line: typical
Dotted lines:
process limits
Lead temperature
235 °C to
260 °C
100 °C to
130 °C
ca. 200 K/s
Forced cooling
ca. 5 K/s
ca. 2 K/s




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