Os motores de busca de Datasheet de Componentes eletrônicos
Selected language  

  Portuguese  ▼

nome da peças
         descrição  


MF-PSML-X Datasheet(Folha de dados) 4 Page - Bourns Electronic Solutions

Nome de Peças. MF-PSML-X
descrição  Low Ohmic PTC Resettable Fuses
Download  7 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Fbricantes  BOURNS [Bourns Electronic Solutions]
Página de início  http://www.bourns.com
Logo 

   
 4 page
background image
MF-NSMF Series - PTC Resettable Fuses
MF-PSML/X Series - Low Ohmic PTC Resettable Fuses
Solder Reflow Recommendations
Notes:
• MF-PSML/X models are intended for reflow soldering (including, but
not limited to heating plate, hot air, IR, nitrogen, and vapor phase).
• Wave soldering is permissible only if the device is on the top of the
PCB, opposite the heat source.
• Hand soldering is not recommended for these devices.
• All temperatures refer to the topside of the device, measured on the
device body surface.
• If reflow temperatures exceed the recommended profile, devices may
not meet the published specifications.
• Compatible with Pb and Pb-free solder reflow profiles.
• Excess solder may cause a short circuit.
• Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering
Recommendations document for more details.
Temperature of Lead/Pad Junction
Process
Materials
Temperature
Time
Description
Interval
1. Apply solder paste to
• Sn 96.5 / Ag 3.0 / Cu 0.5
Room temperature
test board (8 - 10 mil thick)
Alloy water soluble or no
clean solder paste
(see note 1)
• single sided epoxy glass
(G10) (UL approved)
• PC board approx. 4x4x.06 in.
2. Place test units onto board
6 units/board
3. Ramp up
Convection oven
(see note 2)
2.5 °C ± 0.5 °/sec.
4. Preheat (TS
.
c
e
s
0
3
±
0
9
C
°
0
9
1
o
t
C
°
0
5
1
)
5. Time above liquidus (TL
.
c
e
s
0
9
-
0
6
C
°
0
2
2
)
6. Peak temperature (TP
°
5
-
/
°
0
+
C
°
0
5
2
)
10-20 sec. within
5 °C of peak
.
c
e
s
/
C
°
5
.
0
±
C
°
3
e
r
u
t
a
r
e
p
m
e
t
m
o
o
R
n
w
o
d
p
m
a
R
.
7
(see note 2)
8. Cleaning water clean profile High pressure deionized
72 °F to 160 °F
As required
water 65 PSI max.
(22 °C to 71 °C)
Inspect solder joint to determine if solder joint is
acceptable (i.e. exhibits wetting of joint’s surface).
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
A) Acceptable (see Figure 1)
(1) The solder connection wetting angle (solder to
component and solder to PCB termination)
does not exceed 90 °.
(2) Solder balls that do not violate minimum
electrical clearances and are attached
(soldered) to a metal surface.
B) Unacceptable (see Figure 2)
(1) Solder connection wetting angle exceeding
90 °.
(2) Incomplete reflow of solder paste.
(3) Dewetting.
If unacceptable, determine cause and correct prior to
next run.
NOTES:
1. Water soluble solder paste only above 100K.
2. Refer to ref. temperature profile. Temperature at
lead/pad junction with “K” type thermocouple.
3. Units that are board mounted for environmental
testing must see a peak temperature in the reflow
zone, as specified. This is to ensure that all test
units will see “worst case conditions”.
4. Ramp down rate to be measured from 245 °C to
150 °C.
5. Process Description 8 does not apply to open
frame trimmers.
(Derived using 6-zone Convection Oven)
TP
TP
tp
ts
T TO
RAMP-UP
L
TL
t L
25
Ts max
Ts min
PREHEAT
Time
CRITICAL ZONE
RAMP-DOWN
t 25 °C TO PEAK
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
3 °C / second max.
PREHEAT:
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (Tsmin to Tsmax) (ts)
150 °C
200 °C
60~180 seconds
TIME MAINTAINED ABOVE:
Temperature (TL)
Time (tL)
217 °C
60~150 seconds
Peak Temperature (Tp)
260 °C
Time within 5 °C of Actual Peak Temperature (tp)
20~40 seconds
Ramp-Down Rate
6 °C / second max.
Time 25 °C to Peak Temperature
8 minutes max.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.




Html Pages

1  2  3  4  5  6  7 


Datasheet Download




Ligação URL

ALLDATASHEET é util para você?  [ DONATE ]  

Sobre Alldatasheet   |  Publicidade   |   Contato conosco    |   Política de Privacidade   |   Favoritos   |  Troca de Link    |  Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  , Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp  |   Russian : Alldatasheetru.com
Korean : Alldatasheet.co.kr   |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com  |   Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl