MC10E175 MC100E175

MOTOROLA

ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)

0

°C

25

°C

85

°C

Symbol

Characteristic

min

typ

max

min

typ

max

min

typ

max

Unit

Cond

IIH

Input HIGH Current

150

150

150

µA

IEE

Power Supply Current

mA

10E

110

132

110

132

110

132

100E

110

132

110

132

127

152

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)

0

°C

25

°C

85

°C

Symbol

Characteristic

min

typ

max

min

typ

max

min

typ

max

Unit

Cond

tPLH

Propagation Delay to Output

ps

tPHL

D to Q

450

600

800

450

600

800

450

600

800

D to ODDPAR

850

1150

1450

850

1150

1450

850

1150

1450

LEN to Q

525

700

900

525

700

900

525

700

900

LEN to ODDPAR

525

700

900

525

700

900

525

700

900

MR to Q(tPHL)

525

700

900

525

700

900

525

700

900

MR to ODDPAR(tPHL)

525

700

900

525

700

900

525

700

900

ts

Setup Time

ps

D (Q)

275

100

275

275

D (ODDPAR)

900

700

900

900

th

Hold Time

ps

D (Q)

175

–100

175

175

D (ODDPAR)

– 300

– 70

– 300

– 300

tRR

Reset Recovery Time

850

600

850

600

850

600

ps

tSKEW

Within-Device Skew

ps

1

LEN, MR

75

75

75

D to Q

75

75

75

D to ODDPAR

200

200

200

tr

Rise/Fall Times

ps

tf

20 - 80%

300

500

800

300

500

800

300

500

800

1. Within-device skew is defined as identical transitions on similar paths through a device.

FUNCTION TABLE

D

EN

MR

Q

ODDPAR

H

L

L

H

H if odd no. of Dn HIGH

L

L

L

L

H if odd no. of Dn HIGH

X

H

L

Q0

Q0

X

X

H

L

L