MC14557B

http://onsemi.com

8

PACKAGE DIMENSIONS

DIM

MIN

MAX

MIN

MAX

INCHES

–––

2.05

–––

0.081

MILLIMETERS

0.05

0.20

0.002

0.008

0.35

0.50

0.014

0.020

0.18

0.27

0.007

0.011

9.90

10.50

0.390

0.413

5.10

5.45

0.201

0.215

1.27 BSC

0.050 BSC

7.40

8.20

0.291

0.323

0.50

0.85

0.020

0.033

1.10

1.50

0.043

0.059

0

0.70

0.90

0.028

0.035

–––

0.78

–––

0.031

0

_

NOTES:

1.

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2.

CONTROLLING DIMENSION: MILLIMETER.

3.

DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS AND ARE

MEASURED AT THE PARTING LINE. MOLD FLASH

OR PROTRUSIONS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4.

TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5.

THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

M

L

DETAIL P

VIEW P

c

A

b

e

M

0.13 (0.005)

0.10 (0.004)

1

16

9

8

D

Z

E

A

b

c

D

E

e

L

M

Z

SOEIAJ–16

F SUFFIX

PLASTIC EIAJ SOIC PACKAGE

CASE 966–01

ISSUE O

ON Semiconductor and

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