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MC33263 Folha de dados(PDF) 4 Page - ON Semiconductor |
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MC33263 Folha de dados(HTML) 4 Page - ON Semiconductor |
4 / 12 page MC33263 http://onsemi.com 4 DEFINITIONS Load Regulation – The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage – The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage – The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation – The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current – Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation – The change in input voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Line Transient Response – Typical over– and undershoot response when input voltage is excited with a given slope. Thermal Protection – Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically 150 °C, the regulator turns off. This feature is provided to prevent catastrophic failures from accidental overheating. Maximum Package Power Dissipation – The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 125 °C. The junction temperature is rising while the difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation, maximum load current or maximum input voltage (see Application Hints: Protection). The maximum power dissipation supported by the device is a lot increased when using appropriate application design. Mounting pad configuration on the PCB, the board material and also the ambient temperature are affected the rate of temperature rise. It means that when the IC has good thermal conductivity through PCB, the junction temperature will be “low” even if the power dissipation is great. The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature (150 °C for MC33263) and ambient temperature. APPLICATION HINTS Input Decoupling – As with any regulator, it is necessary to reduce the dynamic impedance of the supply rail that feeds the component. A 1 mF capacitor either ceramic or tantalum is recommended and should be connected close to the MC33263 package. Higher values will correspondingly improve the overall line transient response. Output Decoupling – Thanks to a novel concept, the MC33263 is a stable component and does not require any Equivalent Series Resistance (ESR) neither a minimum output current. Capacitors exhibiting ESRs ranging from a few m W up to 3W can thus safely be used. The minimum decoupling value is 1 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Noise Performances – Unlike other LDOs, the MC33263 is a true low–noise regulator. With a 10 nF bypass capacitor, it typically reaches the incredible level of 25 mVRMSoverall noise between 100 Hz and 100 kHz. To give maximum insight on noise specifications, ON Semiconductor includes spectral density graphics as well as noise dependency versus bypass capacitor. The bypass capacitor impacts the start–up phase of the MC33263 as depicted by the data–sheet curves. A typical 1 ms settling time is achieved with a 10 nF bypass capacitor. However, thanks to its low–noise architecture, the MC33263 can operate without bypass and thus offers a typical 20 ms start–up phase. In that case, the typical output noise stays lower than 65 mVRMS between 100 Hz – 100 kHz. Protections – The MC33263 hosts several protections, conferring natural ruggedness and reliability to the products implementing the component. The output current is internally limited to a minimum of 175 mA while temperature shutdown occurs if the die heats up beyond 150 °C. These value lets you assess the maximum differential voltage the device can sustain at a given output current before its protections come into play. The maximum dissipation the package can handle is given by: Pmax + T Jmax –T A RqJA |
Nº de peça semelhante - MC33263 |
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Descrição semelhante - MC33263 |
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