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OPA388, OPA2388, OPA4388

www.ti.com

SBOS777C – DECEMBER 2016 – REVISED MAY 2019

Product Folder Links: OPA388 OPA2388 OPA4388

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Copyright © 2016–2019, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information: OPA388

OPA388

UNIT

D (SOIC)

DBV (SOT-23)

DGK (VSSOP)

8 PINS

5 PINS

5 PINS

Junction-to-ambient thermal resistance

116

145.7

177

°C/W

Junction-to-case (top) thermal resistance

60

94.8

69

°C/W

Junction-to-board thermal resistance

56

43.4

100

°C/W

Junction-to-top characterization parameter

12.8

24.7

9.9

°C/W

Junction-to-board characterization parameter

55.9

43.1

98.3

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: OPA2388

OPA2388

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

165

°C/W

Junction-to-case (top) thermal resistance

53

°C/W

Junction-to-board thermal resistance

87

°C/W

Junction-to-top characterization parameter

4.9

°C/W

Junction-to-board characterization parameter

85

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4388

OPA4388

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

86.4

109.6

°C/W

Junction-to-case (top) thermal resistance

46.3

27.4

°C/W

Junction-to-board thermal resistance

41.0

56.1

°C/W

Junction-to-top characterization parameter

11.3

1.5

°C/W

Junction-to-board characterization parameter

40.7

54.9

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W