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Rev. E, Sep 2005
ML3406
Application Information (4)
Recommend Surface Mount Inductors of
Marker
Part
Value DCR
Max DC
SIZE
Number
Current
WxLxH
(µ
µ
µ
µH)
(Ω
Ω
Ω
ΩMax (A)
(mm
3)
Sumida
1.5
0.043
1.55
3.8x3.8x1.8
CDRH3D16
2.2
0.075
1.20
3.3
0.110
1.10
4.7
0.162
0.90
Sumida
2.2
0.116
0.950
3.5x4.3x0.8
CMD4D06
3.3
0.174
0.770
4.7
0.216
0.750
Panasonic
3.3
0.17
1.00
4.5x5.4x1.2
ELT5KT
4.7
0.20
0.95
Murata
1.0
0.60
1.00
2.5x3.2x2.0
LQH32CN
2.2
0.097
0.79
4.7
0.150
0.65
Figure 7
Figure 9
ML3406 Layout Diagram
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
ML3406. These items are also illustrated graphically in
Figures 7 and 8. Check the following in your layout:.
1. The power traces, consisting of the GND trace, the SW
trace and the VIN trace should be kept short, direct and
wide.
2. Dose the VFB pin connect directly to the feedback
resistors? The resistive divider R1/R2 must be
connected between the (+) plate of COUT and ground.
3. Does the (+) plate of CIN connect to VIN as closely as
possible? This capacitor provides the AC current to the
internal power MOSFETs.
4. Keep the switching node, SW, away from the sensitive
VFB node.
5. Keep the (-)plates of CIN and COUT as close as possible.
Figure 8
Figure 10
ML3406 Layout Diagram
ML3406 -1.8
ML3406-1.8
ML3406