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74LVC07APW Folha de dados(PDF) 10 Page - NXP Semiconductors |
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74LVC07APW Folha de dados(HTML) 10 Page - NXP Semiconductors |
10 / 16 page 2000 Mar 07 10 Philips Semiconductors Product specification Hex buffer with open-drain outputs 74LVC07A UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1.0 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT402-1 MO-153 95-04-04 99-12-27 w M b p D Z e 0.25 17 14 8 θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 A max. 1.10 pin 1 index |
Nº de peça semelhante - 74LVC07APW |
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Descrição semelhante - 74LVC07APW |
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