REG1117

REG1117A

SBVS001D − OCTOBER 1992 − REVISED JULY 2004

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2

Power Dissipation

Internally Limited

. . . . . . . . . . . . . . . . . . . . . . . . . .

Input Voltage

+15V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Junction Temperature Range

−40

°C to +125°C

. . . . . . . .

Storage Temperature Range

−65

°C to +150°C

. . . . . . . . . . . . . . . . .

Lead Temperature (soldering, 10s)(2)

+300

°C

. . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

(2) See Soldering Methods section.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

CONNECTION DIAGRAM

Front View

Plastic SOT−223

Plastic DDPAK

Tab is V

OUT

V

IN

V

OUT

Ground

Tab is

V

OUT

V

IN

V

OUT

Ground

NOTE: (1) Adjustable−Voltage Model.