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MC10EL32 Folha de dados(PDF) 2 Page - ON Semiconductor

Nome de Peças MC10EL32
Descrição Electrónicos  5V ECL 첨2 Divider
Download  9 Pages
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Fabricante Electrônico  ONSEMI [ON Semiconductor]
Página de início  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC10EL32 Folha de dados(HTML) 2 Page - ON Semiconductor

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MC10EL32, MC100EL32
http://onsemi.com
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Figure 1. Logic Diagram and Pinout Assignment
1
2
5
6
7
8
Q
VEE
VCC
Q
CLK
VBB
R
÷2
Reset
CLK
Table 1. PIN DESCRIPTION
PIN
FUNCTION
CLK, CLK
ECL Clock Inputs*
Reset
ECL Asynch Reset*
Q, Q
ECL Data Outputs
VBB
Reference Voltage Output
VCC
Positive Supply
VEE
Negative Supply
EP
Exposed pad must be connected to a sufficient
thermal conduit. Electrically connect to the most
negative supply or leave floating open.
*Pins will default low when left open.
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI  VCC
VI  VEE
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
265
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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