MC14049UB_04 datasheet(7/8 Pages) ONSEMI

Nome de Peças	MC14049UB

Descrição Electrónicos	W Semiconductor Components Industries, LLC, 2004

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MC14049UB

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PACKAGE DIMENSIONS

HE

A1

DIM

MIN

MAX

MIN

MAX

INCHES

−−−

2.05

−−−

0.081

MILLIMETERS

0.05

0.20

0.002

0.008

0.35

0.50

0.014

0.020

0.18

0.27

0.007

0.011

9.90

10.50

0.390

0.413

5.10

5.45

0.201

0.215

1.27 BSC

0.050 BSC

7.40

8.20

0.291

0.323

0.50

0.85

0.020

0.033

1.10

1.50

0.043

0.059

0

0.70

0.90

0.028

0.035

−−−

0.78

−−−

0.031

A1

HE

Q1

LE

_ 10_

0

_ 10_

LE

Q1

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

M

L

DETAIL P

VIEW P

c

A

b

e

M

0.13 (0.005)

0.10 (0.004)

1

16

9

8

D

Z

E

A

b

c

D

E

e

L

M

Z

SOEIAJ−16

F SUFFIX

PLASTIC EIAJ SOIC PACKAGE

CASE 966−01

ISSUE O

Nº de peça semelhante - MC14049UB_04

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
ON Semiconductor	MC14049UBCP	205Kb / 8P	Hex Buffers March, 2000 ??Rev. 3
	MC14049UBCPG	155Kb / 8P	Hex Buffers May, 2013 ??Rev. 8
	MC14049UBD	205Kb / 8P	Hex Buffers March, 2000 ??Rev. 3
	MC14049UBDG	155Kb / 8P	Hex Buffers May, 2013 ??Rev. 8
	MC14049UBDG	107Kb / 7P	Hex Buffers May, 2014 ??Rev. 9

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MC14049UB Folha de dados(PDF) 7 Page - ON Semiconductor

MC14049UB Folha de dados(HTML) 7 Page - ON Semiconductor

Nº de peça semelhante - MC14049UB_04

Descrição semelhante - MC14049UB_04

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