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AM29DL323DT70REIN Folha de dados(PDF) 7 Page - Advanced Micro Devices |
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AM29DL323DT70REIN Folha de dados(HTML) 7 Page - Advanced Micro Devices |
7 / 56 page 6 Am29DL322D/323D/324D December 13, 2005 Special Handling Instructions for FBGA Package Special handling is required for Flash Memory products in FBGA packages. Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150 °C for prolonged periods of time. PIN DESCRIPTION A0–A20 = 21 Addresses DQ0–DQ14 = 15 Data Inputs/Outputs DQ15/A-1 = DQ15 (Data Input/Output, word mode), A-1 (LSB Address Input, byte mode) CE# = Chip Enable OE# = Output Enable WE# = Write Enable WP#/ACC = Hardware Write Protect/ Acceleration Pin RESET# = Hardware Reset Pin, Active Low BYTE# = Selects 8-bit or 16-bit mode RY/BY# = Ready/Busy Output VCC = 3.0 volt-only single power supply (see Product Selector Guide for speed options and voltage supply toler- ances) VSS = Device Ground NC = Pin Not Connected Internally LOGIC SYMBOL 21 16 or 8 DQ0–DQ15 (A-1) A0–A20 CE# OE# WE# RESET# BYTE# RY/BY# WP#/ACC |
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Descrição semelhante - AM29DL323DT70REIN |
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