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TDA1517ATW Folha de dados(PDF) 10 Page - NXP Semiconductors |
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TDA1517ATW Folha de dados(HTML) 10 Page - NXP Semiconductors |
10 / 20 page 2001 Apr 17 10 Philips Semiconductors Product specification 8 W BTL or 2 × 4 W SE power amplifier TDA1517ATW Thermal behaviour (PCB design considerations) The typical thermal resistance [Rth(j-a)] of the IC in the HTSSOP20 package is 37 K/W if the IC is soldered on a printed-circuit board with double sided 35 µm copper with a minimum area of approximately 30 cm2. The actual usable thermal resistance depends strongly on the mounting method of the device on the printed-circuit board, the soldering method and the area and thickness of the copper on the printed-circuit board. The bottom ‘heat-spreader’ of the IC has to be soldered efficiently on the ‘thermal land’ of the copper area of the printed-circuit board using the re-flow solder technique. A number of thermal vias in the ‘thermal land’ provide a thermal path to the opposite copper site of the printed-circuit board. The size of the surface layers should be as large as needed to dissipate the heat. The thermal vias (0.3 mm ∅) in the ‘thermal land’ should not use web construction techniques, because those will have high thermal resistance; continuous connection completely around the via-hole is recommended. For a maximum ambient temperature of 60 °C the following calculation can be made: for the application at VP = 12 V and RL =8 Ω the (ALL-) music power dissipation approximately 2.0 W; Tj(max) =Tamb +P × Rth(j-a) =60 °C + 2.0 × 37 = 134 °C. Note: the above calculation holds for application at ‘average listening level’ music output signals. Applying (or testing) with sine wave signals will produce approximately twice the music power dissipation; at worst case condition this can activate the maximum temperature protection. handbook, full pagewidth 60 50 40 30 20 10 0 K/W 1 0 number of 35 µm copper layers 234 CU-LAYER 2-4 MGU306 L L ON-BOARD-COOLING COPPER DESIGN CU-LAYER 1 Rth(j-a) Rth(j-p) Fig.5 Thermal resistance of the HTSSOP20 mounted on printed-circuit board. Rth(j-p) curve is given for practical calculation purpose. L = 30 mm plus vias |
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