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UZZ9001 Folha de dados(PDF) 6 Page - NXP Semiconductors |
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UZZ9001 Folha de dados(HTML) 6 Page - NXP Semiconductors |
6 / 16 page 2000 Nov 27 6 Philips Semiconductors Product specification Sensor Conditioning Electronic UZZ9001 Table 1 SPI-Timing DIAGRAM NUMBER PARAMETER SYMBOL MIN. MAX. UNIT REMARKS/TEST CONDITIONS 1 cycle time tcyc 1 −µs 2 enable lead time tlead 15 − ns determined by master module 3 enable lag time tlag 15 − ns determined by master module 4 clock high time tclk_high 100 − ns determined by master module 5 clock low time tclk_low 100 − ns determined by master module 8 access time tacc 0 20 ns time to data active from fixed VSS state 9 disable time tdis − 25 ns hold time to fixed VSS state 10 data valid time (after clock edge) tv − 40 ns with 100 pF on all SPI pins 11 data hold time (output, after clock edge) th 5 − ns operating frequency fop − 1 MHz transmission delay (time between the leading edge of CS until the next falling edge) tdelay 1.2 −µs handbook, full pagewidth MHB699 4 5 3 1 9 8 2 11 10 10 MSB-OUT note1 CS CLK DATA LSB-OUT Bits 6-1 Fig.2 UZZ9001 SPI timing. (1) Not defined data, normally LSB of character previously transmitted. |
Nº de peça semelhante - UZZ9001 |
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Descrição semelhante - UZZ9001 |
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