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SM6HT36A Folha de dados(PDF) 4 Page - STMicroelectronics |
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SM6HT36A Folha de dados(HTML) 4 Page - STMicroelectronics |
4 / 5 page 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 1E-1 1E+0 1E+1 1E+2 Zth(j-a)(°C/W) tp(s) Fig. 6: Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4 with recommended pad layout). 012345 40 50 60 70 80 90 100 Rth(j-a) (°C/W) S(cm²) Fig. 7: Thermal resistance junction to ambient ver- sus copper surface under each lead (printed circuit board FR4, e(Cu)=35 µm). 25 50 75 100 125 150 175 1E-4 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 1E+4 IR(µA) Tj(°C) Fig .8: Variation of leakage current versus junction temperature (typical values). SM6HTxxA 4/5 |
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Descrição semelhante - SM6HT36A |
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