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TS321AID Folha de dados(PDF) 10 Page - STMicroelectronics |
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TS321AID Folha de dados(HTML) 10 Page - STMicroelectronics |
10 / 13 page Package information TS321 10/13 5 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5.1 SOT23-5 package information Figure 7. SOT23-5 package mechanical drawing Table 5. SOT23-5 package mechanical data Ref. Dimensions Millimeters Mils Min. Typ. Max. Min. Typ. Max. A 0.901.45 35.457.1 A1 0.00 0.15 0.00 5.9 A2 0.90 1.30 35.4 51.2 b 0.350.50 13.719.7 C 0.09 0.20 3.5 7.8 D 2.80 3.00 110.2 118.1 E 2.60 3.00 102.3 118.1 E1 1.50 1.75 59.0 68.8 e 0.95 37.4 e1 1.9 74.8 L 0.350.55 13.721.6 |
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Descrição semelhante - TS321AID |
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