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TS274IPT Folha de dados(PDF) 10 Page - STMicroelectronics |
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TS274IPT Folha de dados(HTML) 10 Page - STMicroelectronics |
10 / 14 page Package information TS274 10/14 5 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5.1 DIP14 package information Figure 15. DIP14 package mechanical drawing Table 5. DIP14 package mechanical data Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. a1 0.51 0.020 B 1.39 1.65 0.055 0.065 b0.5 0.020 b1 0.25 0.010 D20 0.787 E8.5 0.335 e 2.54 0.100 e3 15.24 0.600 F 7.1 0.280 I 5.1 0.201 L3.3 0.130 Z 1.27 2.54 0.050 0.100 |
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Descrição semelhante - TS274IPT |
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