SBW-5089 DC-8.0 GHz Cascadeable MMIC Amplifier

EDS-103325 Rev. C

6

Phone: (800) SMI-MMIC

http://www.sirenza.com

303 South Technology Court

Broomfield, CO 80021

SOT-89 PCB Pad Layout

Dimensions in inches [millimeters]

SOT-89 Nominal Package Dimensions

Dimensions in inches [millimeters]

A link to the SOT-89 package outline drawing with full dimensions and

tolerances may be found on the product web page at www.sirenza.com.

RF

OUT

RF

I N

Notes:

1 Solder the copper pad on the backside of the device

package to the ground plane.

2 Provide a large ground pad area under device pins 1,

2, 4, & 5 with many plated via holes as shown.

3 Dimensions given for 50 Ohm RF I/O lines are for 31

mil thick Getek. Scale accordingly for different board

thicknesses and dielectric contants.

4. We recommend 1 or 2 ounce copper. Measurements

for this data sheet were made on a 31 mil thick

Getek with 1 ounce copper on both sides.