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TC1070VCT Folha de dados(PDF) 5 Page - TelCom Semiconductor, Inc

Nome de Peças TC1070VCT
Descrição Electrónicos  50mA ADJUSTABLE CMOS LDO WITH SHUTDOWN
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Fabricante Electrônico  TELCOM [TelCom Semiconductor, Inc]
Página de início  http://www.telcom-semi.com
Logo TELCOM - TelCom Semiconductor, Inc

TC1070VCT Folha de dados(HTML) 5 Page - TelCom Semiconductor, Inc

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TC1070
5
PRELIMINARY INFORMATION
TC1070-01
6/13/97
50mA ADJUSTABLE CMOS
LDO WITH SHUTDOWN
Equation 2 can be used in conjunction with Equation 3
to ensure regulator thermal operation is within limits. For
example:
Given:
VIN
MAX = 3.0V ±10%
VOUT
MIN = 2.7V ±0.5V
ILOAD = 40mA
TAMAX = 55°C
Find:
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
= [(3.0 x 1.05) – (2.7 x .995)]40 x 10–3
= 18.5mW
Maximum allowable power dissipation:
PD
MAX = (TJMAX – TAMAX)
θJA
= (125 – 55)
220
= 318mW
In this example, the TC1070 dissipates a maximum of
only 60mW; far below the allowable limit of 318mW. In a
similar manner, Equation 2 and Equation 3 can be used to
calculate maximum current and/or input voltage limits.
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a ground
plane, wide traces at the pads, and wide power supply bus
lines combine to lower
θJA and therefore increase the
maximum allowable power dissipation limit.


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