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SN74AC245N Folha de dados(PDF) 1 Page - Texas Instruments |
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SN74AC245N Folha de dados(HTML) 1 Page - Texas Instruments |
1 / 6 page SN54AC245, SN74AC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCAS461D – FEBRUARY 1995 – REVISED DECEMBER 1996 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D EPICt (Enhanced-Performance Implanted CMOS) 1- mm Process D Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Flatpacks (W), and Standard Plastic (N) and Ceramic (J) DIPs description The ’AC245 octal bus transceivers are designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. When the output-enable (OE) is low, the device passes noninverted data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction control (DIR) input. A high on OE disables the device so that the buses are effectively isolated. The SN54AC245 is characterized for operation over the full military temperature range of – 55 °C to 125 °C. The SN74AC245 is characterized for operation from – 40 °C to 85°C. FUNCTION TABLE INPUTS OPERATION OE DIR OPERATION L L H L H X B data to A bus A data to B bus Isolation Copyright © 1996, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. EPIC is a trademark of Texas Instruments Incorporated. SN54AC245 ...J OR W PACKAGE SN74AC245 . . . DB, DW, N, OR PW PACKAGE (TOP VIEW) 3 2 1 20 19 9 10 11 12 13 4 5 6 7 8 18 17 16 15 14 B1 B2 B3 B4 B5 A3 A4 A5 A6 A7 SN54AC245 . . . FK PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 DIR A1 A2 A3 A4 A5 A6 A7 A8 GND VCC OE B1 B2 B3 B4 B5 B6 B7 B8 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. |
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