FEATURES AND SPECIFICATIONS

SPECIIFICATIONS

SL™ (Stackable Linear)

Compliant Pin Header

2.54mm (.100”) Pitch

74095

Compliant Pin Header

Molex’s SL™ (Stackable Linear) compliant-pin header reduces wave-soldering issues

for wire-to-board and board-to-board terminations in industrial equipment,

telecommunications and automotive applications

The SL product family is a modular, single-row, wire-to-wire and wire-to-board

system. Developed for versatility, SL headers are intended for applications such as

lower power and signal devices including computers, medical instruments and

automotive controls. This interconnect system mates with other Molex systems such

as the C-Grid ® and KK ®.

The new press-fit headers are an extension of the SL family which offers post

reflow/wave soldering on-board termination. This eliminates the need for soldering

thus reduces the usual quality issues related to wave soldering. The press-fit

termination provides reliable and stable connection onto the PCB and allows easy

repair/replacement of the connector to be carried out easily, saving the user

valuable time and cost.

The press-fit header mates with the 70066 (SL™ ), 70400 (C-Grid® ) and 70430

(C-Grid SL™ ) series receptacles.

For more information about the SL connector family, please visit:

http://www.molex.com/product/cgrid/

Features

Benefits

termination

25-Circuit SL Header

*Currently, only 25-circuit size is available. Other sizes are upon request.

Reference Information

Packaging: Tube

UL File No.: TBA

CSA File No.: TBA

Mates With Receptacles:

SL™ (Series 70066)

C-Grid SL™ (Series 70430)

Designed In: Millimeters

Electrical

Voltage (max.): 250V

Current (max.): 3.0A

Contact Resistance: 30 milliohms

Dielectric Withstanding Voltage: 1500V AC

Insulation Resistance: 100 Megohms

Mechanical

Contact Retention to Housing: 8.9N

(2.00lb)

Insertion Force to PCB: 106.7N (24.00lb)

Retention Force to PCB: 35.6N (8.00lb)

Durability (min.): 25 cycles

Physical

Housing: Black polyester UL 94V-0

Contact: Copper alloy

Plating:

Contact Area — See ordering chart below

Solder Tail Area — Tin/Lead (PbSn)

Underplating — Nickel (Ni) overall

Recommended PCB Board thickness: 2.36mm (.093”)

Operating Temperature: 0°C to +75°C