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LA112B-SRF.DBK-R1-PF Folha de dados(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LA112B-SRF.DBK-R1-PF Folha de dados(HTML) 7 Page - LIGITEK electronics co., ltd. |
7 / 7 page Page 6/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard Test Condition Test Item 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test Reliability Test: JIS C 7021: B-12 The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test MIL-STD-883:1008 JIS C 7021: B-10 PART NO. LA112B/SRF.DBK-R1-PF |
Nº de peça semelhante - LA112B-SRF.DBK-R1-PF |
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Descrição semelhante - LA112B-SRF.DBK-R1-PF |
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