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LA209B-1-G2H4Y-PF Folha de dados(PDF) 8 Page - LIGITEK electronics co., ltd. |
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LA209B-1-G2H4Y-PF Folha de dados(HTML) 8 Page - LIGITEK electronics co., ltd. |
8 / 8 page The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Thermal Shock Test 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202:103B JIS C 7021: B-11 The purpose of this test is the resistance of the device under tropical for hours. High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test Item Test Condition The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard Description Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 7/7 PART NO. LA209B-1/G2H4Y-PF |
Nº de peça semelhante - LA209B-1-G2H4Y-PF |
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Descrição semelhante - LA209B-1-G2H4Y-PF |
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