SAMWHA ELECTRONICS CO., LTD

http://www.samwha.com/chip

This description in the this catalogue is subject to change without notice

DPS-081104

CHIP BEADS

Soldering Profile

2 sec. max.

150

v Reflow Soldering

v Flow Soldering

v Manual Soldering

Cooling

Soldering

Pre - heating

150

60~120 sec.

10 sec. max.

60 sec. min.

245±5℃

180

230

30~60 sec.

Cooling

Soldering

Pre - heating

250

60 sec. min.

10 sec. max.

60 sec. min.

250±5℃

180

300

Tc

Soldering Iron : 30W max.

Diameter of soldering iron : 1.2 mm max.