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SS1004681KL Folha de dados(PDF) 1 Page - ABC Taiwan Electronics Corp |
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SS1004681KL Folha de dados(HTML) 1 Page - ABC Taiwan Electronics Corp |
1 / 6 page / sec max. +2.0 ~ 4.0℃ Reflow Area SS1004□□□□L□-□□□ SPECIFICATION FOR APPROVAL Ⅲ﹒ MATERIALS: AE-001A Ⅳ﹒ GENERAL SPECIFICATION: c﹒Wire :Enamelled copper wire (class F) e﹒Resisance to solder heat:260℃.10 secs. & L / LOA=25% typ. △ f﹒Remark:Products comply with RoHS' a﹒Temp. rise :40℃ typ. d﹒Operating temp.:-40℃----+105℃ c﹒Storage temp.:-40℃ ----+125℃ b﹒Rated current:Base on temp. rise a﹒Core:Ferrite DR core d﹒Plastic:GAP Spacer e﹒Terminal:Ag/Ni/Sn b﹒Core:Ferrite RI core requirements 100 0 50 50 150 250 200 Time ( seconds ) 100 150 Max time above 200℃ :70sec max. Max time above 230℃ :50sec max. Peak Temp:260℃ max. Temperature Rising Area +4.0 / sec max. ℃ 150 ~ 200 / 60 ~ 120sec ℃ Preheat Area PROD. NAME Ⅱ﹒ SCHEMATIC DIAGRAM: Ⅰ﹒ CONFIGURATION & DIMENSIONS: REF : C ( PCB Pattern ) D POWER INDUCTOR Marking SHIELDED SMD C : 2.9 typ. F : 2.8 ref. E : 10.0 ref. D : 10.0 ref. A : 9.9±0.3 B : 4.5±0.3 ABC'S DWG NO. ABC'S ITEM NO. 260℃ 200 250 70sec max. 50sec max. 230℃ e Peak Temperature: Forced Cooling Area -(1.0 ~ 5.0) / sec max. ℃ d c a b m/m m/m m/m m/m m/m m/m PAGE: 1 |
Nº de peça semelhante - SS1004681KL |
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Descrição semelhante - SS1004681KL |
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