CYStech Electronics Corp.

Spec. No. : C817I3-H

Issued Date : 2003.04.02

Revised Date: 2009.02.04

Page:5/5

BTB772I3

CYStek Product Specification

TO-251 Dimension

*: Typical

Inches

Millimeters

A

E

F

G

H

J

I

3

2

1

K

C

D

B

Style: Pin 1.Base 2.Collector 3.Emitter

3-Lead TO-251 Plastic Package

CYStek Package Code: I3

Marking:

B772

□ □□

Device

name

HFE rank

Date Code

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.0177

0.0217

0.45

0.55

G

0.2559

-

6.50

-

B

0.0354

0.0591

0.90

1.50

H

-

*0.1811

-

*4.60

C

0.0177

0.0236

0.45

0.60

I

-

0.0449

-

1.14

D

0.0866

0.0945

2.20

2.40

J

-

0.0346

-

0.88

E

0.2441

0.2677

6.20

6.80

K

0.2047

0.2165

5.20

5.50

F

0.2677

0.2835

6.80

7.20

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: KFC; pure tin plated

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.