6

FN6294.3

May 6, 2010

Timing Diagrams

Pin Descriptions

SYMBOL

DESCRIPTION

HB

High-side bootstrap supply. External bootstrap capacitor is required. Connect positive side of bootstrap capacitor to this pin.

Bootstrap diode is on-chip.

HO

High-side output. Connect to gate of high-side power MOSFET.

HS

High-side source connection. Connect to source of high-side power MOSFET. Connect negative side of bootstrap capacitor to this

pin.

HI

High-side input.

LI

Low-side input.

Chip negative supply, which will generally be ground.

LO

Low-side output. Connect to gate of low-side power MOSFET.

EPAD

Exposed pad. Connect to ground or float. The EPAD is electrically isolated from all other pins.

FIGURE 3. PROPAGATION DELAYS

FIGURE 4. DELAY MATCHING

HI,

LI

HO,

LO

LI

HI

LO

HO

Typical Performance Curves

FIGURE 5. ISL2100A IDD OPERATING CURRENT vs

FREQUENCY

FIGURE 6. ISL2101A IDD OPERATING CURRENT vs

FREQUENCY

10

100

1 .10

3

0.1

1

10

FREQUENCY (kHz)

T = -40°C

T = +25°C

T = +125°C

T = +150°C

10

100

0.1

1

10

FREQUENCY (kHz)

T = -40°C

T = +25°C

T = +150°C

T = +125°C

ISL2100A, ISL2101A