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TS3DDR3812 Folha de dados(PDF) 3 Page - Texas Instruments

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Nome de Peças TS3DDR3812
Descrição Electrónicos  12-Channel, 1:2 MUX/DEMUX Switch for DDR3 Applications
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Fabricante Electrônico  TI [Texas Instruments]
Página de início  http://www.ti.com
Logo TI - Texas Instruments

TS3DDR3812 Folha de dados(HTML) 3 Page - Texas Instruments

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TS3DDR3812
www.ti.com
SCDS314A
– FEBRUARY 2011 – REVISED MARCH 2011
TERMINAL FUNCTIONS
PIN
DESCRIPTION
NAME
NUMBER
VCC
1,17, 30
Supply Voltage
GND
ThermalPad
Ground
EN
8
Enable Input
SEL1
9
Select Input
SEL2
10
Select Input
A0, A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11
2, 3, 4, 5, 6, 7, 11, 12, 13, 14, 15, 16
Data I/Os
B0, B1, B2, B3, B4, B5, B6, B7, B8, B9, B10, B11
41, 39, 38, 36, 34, 32, 29, 27, 25, 23, 21, 19
Data I/Os
C0, C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11
42, 40, 37, 35, 33, 31, 28, 26, 24, 22, 20, 18
Data I/Os
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
4.6
V
VI/O
Analog voltage range(2)(3)(4)
A, B, C
–0.5
7
V
VIN
Digital input voltage range(2)(3)
SEL1, SEL2
–0.5
7
V
II/OK
Analog port diode current
VI/O < 0
–50
mA
IIK
Digital input clamp current
VIN < 0
–50
mA
II/O
On-state switch current(5)
A, B, C
–128
128
mA
IDD, IGND
Continuous current through VDD or GND
–100
100
mA
θJA
Package thermal impedance(6)
RUA package
31.8
°C/W
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under
"Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under
"recommended operating
conditions
" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground, unless otherwise specified.
(3)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4)
VI and VO are used to denote specific conditions for VI/O.
(5)
II and IO are used to denote specific conditions for II/O
(6)
The package thermal impedance is calculated in accordance with JESD 51-7.
Copyright
© 2011, Texas Instruments Incorporated
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