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SD-45560-001 Folha de dados(PDF) 9 Page - Molex Electronics Ltd. |
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SD-45560-001 Folha de dados(HTML) 9 Page - Molex Electronics Ltd. |
9 / 27 page HANDYLINK™ APPLICATION SPECIFICATION REVISION: ECR/ECN INFORMATION: SHEET No. EC No: UCP2009-1982 B DATE: 2009/02/09 TITLE: APPLICATION SPECIFICATION HANDYLINK™I/O CONNECTOR SYSTEM 9 of 27 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: SD-45560-001 M. Simmel/D. Morgan M. Ibarra S. Miller TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC 9 5.2.3 Reflow Profile While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only. 5.2.4 Inspection Solder joints should be inspected using established conventional methods. 5.3 45339 Plug Module for Wire Termination 5.3.1 Applicable Wire Sizes Copper conductor size: 22 to 34 AWG (stranded wires are recommended for flexibility) may be used, however, 22 to 28 AWG conductors are necessary to transmit 1.5 Amperes DC continuously. Maximum insulation diameter: 1.6mm NOTE: Small conductor sizes are suitable for the transmission of digital signals, and may improve wire bundle flexibility and harness workability. 5.3.2 Wire Preparation Strip length: 2.0 ~ 2.5mm Pre-tinning is recommended. 5.3.3 Inspection Solder joints should be inspected using established conventional methods . 5.4 45593 Plug Module for PCB Termination 5.4.1 PCB Layout See the applicable Sales Drawing for an illustration of the recommended PCB hole layout. 5.4.2 Inspection Solder joints should be inspected using established conventional methods . |
Nº de peça semelhante - SD-45560-001 |
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Descrição semelhante - SD-45560-001 |
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