Os motores de busca de Datasheet de Componentes eletrônicos |
|
SI1563DH Folha de dados(PDF) 11 Page - Vishay Siliconix |
|
SI1563DH Folha de dados(HTML) 11 Page - Vishay Siliconix |
11 / 14 page AN816 Vishay Siliconix www.vishay.com 2 Document Number: 71405 12-Dec-03 FIGURE 3. Front of Board SC70-6 Back of Board SC70-6 D1 G2 S2 S1 G1 D2 SC70−6 DUAL vishay.com THERMAL PERFORMANCE Junction-to-Foot Thermal Resistance (the Package Performance) Thermal performance for the dual SC-70 6-pin package is measured as junction-to-foot thermal resistance, in which the “foot” is the drain lead of the device as it connects with the body. The junction-to-foot thermal resistance for this device is typically 80_C/W, with a maximum thermal resistance of approximately 100_C/W. This data compares favorably with another compact, dual-channel package – the dual TSOP-6 – which features a typical thermal resistance of 75_C/W and a maximum of 90_C/W. Power Dissipation The typical RθJA for the dual-channel 6-pin SC-70 with a copper leadframe is 224_C/W steady-state, compared to 413_C/W for the Alloy 42 version. All figures are based on the 1-inch2 FR4 test board. The following example shows how the thermal resistance impacts power dissipation for the dual 6-pin SC-70 package at varying ambient temperatures. Alloy 42 Leadframe ALLOY 42 LEADFRAME Room Ambient 25 _C Elevated Ambient 60 _C PD + TJ(max) * TA RqJA PD + 150oC * 25oC 413oC W PD + 303 mW PD + TJ(max) * TA RqJA PD + 150oC * 60oC 413oC W PD + 218 mW COOPER LEADFRAME Room Ambient 25 _C Elevated Ambient 60 _C PD + TJ(max) * TA RqJA PD + 150oC * 25oC 224oC W PD + 558 mW PD + TJ(max) * TA RqJA PD + 150oC * 60oC 224oC W PD + 402 mW Although they are intended for low-power applications, devices in the 6-pin SC-70 dual-channel configuration will handle power dissipation in excess of 0.5 W. TESTING To further aid the comparison of copper and Alloy 42 leadframes, Figures 4 and 5 illustrate the dual-channel 6-pin SC-70 thermal performance on two different board sizes and pad patterns. The measured steady-state values of RθJA for the dual 6-pin SC-70 with varying leadframes are as follows: LITTLE FOOT 6-PIN SC-70 Alloy 42 Copper 1) Minimum recommended pad pattern on the EVB board (see Figure 3). 518_C/W 344_C/W 2) Industry standard 1-inch2 PCB with maximum copper both sides. 413_C/W 224_C/W The results indicate that designers can reduce thermal resistance (θJA) by 34% simply by using the copper leadframe device as opposed to the Alloy 42 version. In this example, a 174_C/W reduction was achieved without an increase in board area. If an increase in board size is feasible, a further 120_C/W reduction can be obtained by utilizing a 1-inch2. PCB area. The Dual copper leadframe versions have the following suffix: Dual: Si19xxEDH Compl.: Si15xxEDH |
Nº de peça semelhante - SI1563DH |
|
Descrição semelhante - SI1563DH |
|
|
Ligação URL |
Privacy Policy |
ALLDATASHEETPT.COM |
ALLDATASHEET é útil para você? [ DONATE ] |
Sobre Alldatasheet | Publicidade | Contato conosco | Privacy Policy | roca de Link | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |