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TMP104YFFT Folha de dados(PDF) 2 Page - Texas Instruments |
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TMP104YFFT Folha de dados(HTML) 2 Page - Texas Instruments |
2 / 24 page TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PACKAGE PRODUCT PACKAGE-LEAD DESIGNATOR PACKAGE MARKING ORDERING NUMBER TMP104YFFR TMP104 DSBGA-4 YFF T4 TMP104YFFT (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) TMP104 UNIT Supply voltage 3.6 V Input voltage –0.3 to (V+) + 0.3 V Operating temperature –55 to +150 °C Storage temperature –60 to +150 °C Junction temperature +150 °C Human body model (HBM) 2000 V ESD rating Charged device model (CDM) 1000 V Machine model (MM) 200 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. THERMAL INFORMATION TMP104 THERMAL METRIC(1) YFF UNITS 4 PINS θJA Junction-to-ambient thermal resistance 188.5 θJCtop Junction-to-case (top) thermal resistance 2.1 θJB Junction-to-board thermal resistance 35.1 °C/W ψJT Junction-to-top characterization parameter 10.6 ψJB Junction-to-board characterization parameter 35.1 θJCbot Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TMP104 |
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