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MC10EL32MNR4G Folha de dados(PDF) 2 Page - ON Semiconductor |
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2 / 9 page MC10EL32, MC100EL32 http://onsemi.com 2 4 3 Figure 1. Logic Diagram and Pinout Assignment 1 2 5 6 7 8 Q VEE VCC Q CLK VBB R ÷2 Reset CLK Table 1. PIN DESCRIPTION PIN FUNCTION CLK, CLK ECL Clock Inputs* Reset ECL Asynch Reset* Q, Q ECL Data Outputs VBB Reference Voltage Output VCC Positive Supply VEE Negative Supply EP (DFN8 only) Thermal exposed pad must be con- nected to a sufficient thermal conduit. Electric- ally connect to the most negative supply (GND) or leave unconnected, floating open. *Pins will default low when left open. Table 2. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V VI VCC VI VEE 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 ± 5% °C/W Tsol Wave Solder <2 to 3 sec @ 248°C 265 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder Pb Pb−Free <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C qJC Thermal Resistance (Junction−to−Case) (Note 1) DFN8 35 to 40 °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) |
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