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AD5122BRUZ100-RL7 Folha de dados(PDF) 11 Page - Analog Devices |
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AD5122BRUZ100-RL7 Folha de dados(HTML) 11 Page - Analog Devices |
11 / 32 page Data Sheet AD5122/AD5142 Rev. 0 | Page 11 of 32 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 6. Parameter Rating V DD to GND −0.3 V to +7.0 V V SS to GND +0.3 V to −7.0 V V DD to VSS 7 V V LOGIC to GND −0.3 V to V DD + 0.3 V or +7.0 V (whichever is less) V A, VW, VB to GND V SS − 0.3 V, VDD + 0.3 V or +7.0 V (whichever is less) I A, IW, IB Pulsed1 Frequency > 10 kHz R AW = 10 kΩ ±6 mA/d2 R AW = 100 kΩ ±1.5 mA/d2 Frequency ≤ 10 kHz R AW = 10 kΩ ±6 mA/√d2 R AW = 100 kΩ ±1.5 mA/√d2 Digital Inputs −0.3 V to V LOGIC + 0.3 V or +7 V (whichever is less) Operating Temperature Range, T A 3 −40°C to +125°C Maximum Junction Temperature, T J Maximum 150°C Storage Temperature Range −65°C to +150°C Reflow Soldering Peak Temperature 260°C Time at Peak Temperature 20 sec to 40 sec Package Power Dissipation (T J max − TA)/θJA ESD4 4 kV FICDM 1.5 kV 1 Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A, B, and W terminals at a given resistance. 2 d = pulse duty factor. 3 Includes programming of EEPROM memory. 4 Human body model (HBM) classification. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is defined by the JEDEC JESD51 standard, and the value is dependent on the test board and test environment. Table 7. Thermal Resistance Package Type θ JA θ JC Unit 16-Lead LFCSP 89.51 3 °C/W 16-Lead TSSOP 150.41 27.6 °C/W 1 JEDEC 2S2P test board, still air (0 m/sec airflow). ESD CAUTION |
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