FDC6506P Rev. C

Figure 7. Gate-Charge Characteristics.

Figure 8. Capacitance Characteristics.

Figure 9. Maximum Safe Operating Area.

Figure 10. Single Pulse Maximum

Power Dissipation.

Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1c.

Transient themal response will change depending on the circuit board design.

0.0001

0.001

0.01

0.1

1

10

100

300

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t / t

1

2

T - T

= P * R

(t)

A

J

P(pk)

R

(t) = r(t) * R

R

=180°C/W

θJA

θJA

θJA

0.01

0.1

1

10

100

300

0

1

2

3

4

5

SINGLE PULSE TIME (SEC)

SINGLE PULSE

R

=180°C/W

T = 25°C

θJA

A

0.1

0.2

0.5

1

2

5

10

20

50

0.01

0.03

0.1

0.3

1

3

10

30

-V

, DRAIN-SOURCE VOLTAGE (V)

RDS(

ON)

LI

MI

T

DS

V

= -10V

SINGLE PULSE

R

= 180°C/W

T

= 25°C

θJA

GS

A

DC

1s

100ms

10ms

1ms

100us

0

2

4

6

8

10

0

123

4

-10V

-15V

0

60

120

180

240

300

0

6

12

18

24

30

f=1MHz