DAC101C081, DAC101C081Q, DAC101C085

SNVS801A – APRIL 2012 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

−0.3V to +6.5V

Voltage on any Input Pin

−0.3V to +6.5V

±10 mA

±20 mA

Human Body Model

2500V

ADR0, ADR1 pins:

Machine Model

250V

Charged Device Model (CDM)

1000V

Human Body Model

5000V

SDA, SCL pins:

Machine Model

350V

Charged Device Model (CDM)

1000V

Junction Temperature

+150°C

Storage Temperature

−65°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating

Ratings is not recommended.

(2)

All voltages are measured with respect to GND = 0V, unless otherwise specified.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

When the input voltage at any pin exceeds 5.5V or is less than GND, the current at that pin should be limited to 10 mA. The 20 mA

maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10

mA to two.

(5)

fault condition (e.g., when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).

(6)

Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is a 220 pF capacitor discharged

through 0

Ω. Charge device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an

automated assembler) then rapidly being discharged.

4

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