Os motores de busca de Datasheet de Componentes eletrônicos |
|
BD00HC0WEFJ Folha de dados(PDF) 10 Page - Rohm |
|
BD00HC0WEFJ Folha de dados(HTML) 10 Page - Rohm |
10 / 20 page 10/17 BD00HC0WEFJ Datasheet TSZ02201-0R6R0A600060-1-2 © 2013 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111・15・001 17.Jan.2013 Rev.002 ●Power Dissipation ◎HTSOP-J8 Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed temperature limits and thermal design should allow sufficient margin beyond these limits. 1. Ambient temperature Ta can be no higher than 85℃. 2. Chip junction temperature (Tj) can be no higher than 150℃. Chip junction temperature can be determined as follows: Most of the heat loss that occurs in the BD00HC0WEFJ is generated from the output Pch FET. Power loss is determined by the total VCC-VO voltage and output current. Be sure to confirm the system input and output voltage as well as the output current conditions in relation to the heat dissipation characteristics of the VCC and VO in the design. Bearing in mind that heat dissipation may vary substantially depending on the substrate employed (due to the power package incorporated in the BD00HC0WEFJ make certain to factor conditions such as substrate size into the thermal design. Power consumption [W] = Input voltage (VCC) - Output voltage (VO) ×IO (Ave) Example) Where VCC=5.0V, VO=3.3V, IO(Ave) = 0.5A, Power consumption [W] = 5.0V - 3.3V ×0.5A =0.85[W] Measurement condition: mounted on a ROHM board, Substrate size: 70mm×70mm×1.6mm (Substrate with thermal via) ・Solder the thermal pad to Ground ① IC only θj-a=249.5℃/W ② 1-layer(copper foil are :0mm×0mm) θj-a=153.2℃/W ③ 2-layer(copper foil are :15mm×15mm) θj-a=113.6℃/W ④ 2-layer(copper foil are :70mm×70mm) θj-a=59.2℃/W ⑤ 4-layer(copper foil are :70mm×70mm) θj-a=33.3℃/W 0 25 50 75 100 125 150 0 2.0 3.0 4.0 ①0.50W 周囲温度:Ta [℃] 1.0 ①0.50W ②0.82W ③1.10W ④2.11W ⑤3.76W Ambient Temperature :Ta [℃] Calculation based on ambient temperature (Ta) Tj=Ta+θj-a×W <Reference values> 1-layer substrate (copper foil density 0mm×0mm) 2-layer substrate (copper foil density 15mm×15mm) 2-layer substrate (copper foil density 70mm×70mm) 4-layer substrate (copper foil density 70mm×70mm) Substrate size: 70mm×70mm×1.6mm (substrate with thermal via) θj-a: HTSOP-J8 153.2℃/W 113.6℃/W 59.2℃/W 33.3℃/W |
Nº de peça semelhante - BD00HC0WEFJ_13 |
|
Descrição semelhante - BD00HC0WEFJ_13 |
|
|
Ligação URL |
Privacy Policy |
ALLDATASHEETPT.COM |
ALLDATASHEET é útil para você? [ DONATE ] |
Sobre Alldatasheet | Publicidade | Contato conosco | Privacy Policy | roca de Link | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |