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CB042E0474 Folha de dados(PDF) 6 Page - AVX Corporation |
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CB042E0474 Folha de dados(HTML) 6 Page - AVX Corporation |
6 / 10 page 15 Film Chip Capacitors PET-HT DIELECTRIC – CB Series MOUNTING AND SOLDERING RECOMMENDATIONS *Reflow soldering referring to JEDEC Standard with some limitations *JEDEC J-Std 020C SOLDERING PROFILE The capacitors can be mounted using infrared and vapor phase soldering following recommended below. They are NOT suitable for wave soldering. All temperature refer to topside of the package, measured on the package body surface. RECOMMENDED SOLDER PASTE THICKNESS Profile Feature 2220 to 2824 4030 to 6054 Ramp-Up (Ts max to Tp) 3°C / second max 3°C / second max Preheat - Temperature Min (Ts min) 150°C 150°C - Temperature Min (Ts max) 200°C 200°C - Time (ts min to ts max) 180 sec. max 180 sec. max Time maintained above - Temperature (TL) 217°C 217°C - Time (tL) 60 sec. max 75 sec. max Peak temperature (Tp) 240°C 245°C Time within 5°C of peak 10 sec. 10 sec. temperature (tp) Ramp-Down 6°C / sec. 6°C / sec. For optimum solderability, the recommended soldering paste thickness: 2220 to 2824 :150 to 200µm 4030 to 6054 :200 to 300µm In case of hand soldering, the temperature of the soldering iron should not be above 250°C. Special care must be taken to avoid touching the capacitor body with the iron tip. Size Code Case Size A B C 04 2220 5.00 (0.195) 1.90 (0.075) 4.50 (0.178) 05 2824 6.00 (0.234) 2.50 (0.098) 5.70 (0.224) 16 4030 7.50 (0.295) 3.00 (0.118) 8.00 (0.315) 17 5040 11.2 (0.441) 3.50 (0.137) 10.3 (0.406) 18 6064 14.6 (0.575) 3.60 (0.147) 12.6 (0.496) PAD DIMENSIONS: millimeters (inches) A CB RECOMMENDED CLEANING To clean flux from the PC board assembly, the recommended products are: ethanol, isopropyl alcohol, and deionized water wash. The cleaning products to avoid are: Toluene, Xylene, Trichloroethylene, Terpene Cleaner EC-7, surface active agent. In case of using another solvent, please contact us. OTHER CAUTIONS Flame retardancy: the dielectric film is not a flame retardant material. Environment: contact us when chips are used in humid or gas atmosphere and /or when using resin. Recommended handling: do not use edged tools, so not to damage the capacitors. TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121 Stress Type Ref. Spec. Test Conditions Analysis Results Temperature cycling JESD22-A104 -55°C +85(+10/-0)°C air SEM x 1000 Pass 5 to 10 minutes soak 3 cycles/hour Ambient Temperature / 30+/-2°C - 60+/-3% RH -2000H SEM x 1000 Pass Humidity Storage High Temperature / 70+/-5°C - 93+3/-2% RH -1000H SEM x 1000 Pass Humidity Storage 030 Time (seconds) 60 90 120 150 180 210 240 Ramp down Ramp up 270 300 330 Tp Tp - 5ºC Ts min Ts max TL tS tp tL |
Nº de peça semelhante - CB042E0474 |
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Descrição semelhante - CB042E0474 |
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