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M74VHC1GT00DFT2G Folha de dados(PDF) 2 Page - ON Semiconductor |
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M74VHC1GT00DFT2G Folha de dados(HTML) 2 Page - ON Semiconductor |
2 / 6 page MC74VHC1GT00 http://onsemi.com 2 MAXIMUM RATINGS Symbol Characteristics Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V VOUT DC Output Voltage VCC = 0 High or Low State −0.5 to 7.0 −0.5 to VCC + 0.5 V IIK Input Diode Current −20 mA IOK Output Diode Current VOUT < GND; VOUT > VCC +20 mA IOUT DC Output Current, per Pin +25 mA ICC DC Supply Current, VCC and GND +50 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 _C TJ Junction Temperature Under Bias )150 _C qJA Thermal Resistance SC70−5/SC−88A/SOT−353 (Note 1) SOT23−5/TSOP−5/SC59−5 350 230 _C/W PD Power Dissipation in Still Air at 85_CSC70−5/SC−88A/SOT−353 SOT23−5/TSOP−5/SC59−5 150 200 mW MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) u2000 u200 N/A V ILATCHUP Latchup Performance Above VCC and Below GND at 125_C (Note 5) $500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC DC Supply Voltage 3.0 5.5 V VIN DC Input Voltage 0.0 5.5 V VOUT DC Output Voltage VCC = 0 High or Low State 0.0 0.0 5.5 VCC V TA Operating Temperature Range −55 +125 °C tr , tf Input Rise and Fall Time VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V 0 0 100 20 ns/V Device Junction Temperature versus Time to 0.1% Bond Failures Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 TIME, YEARS FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR Figure 3. Failure Rate vs. Time Junction Temperature |
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