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TMP275AIDGKRG4 Folha de dados(PDF) 2 Page - Texas Instruments

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Nome de Peças TMP275AIDGKRG4
Descrição Electrónicos  0.5 C Digital Out Temperature Sensor
Download  19 Pages
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Fabricante Electrônico  TI [Texas Instruments]
Página de início  http://www.ti.com
Logo TI - Texas Instruments

TMP275AIDGKRG4 Folha de dados(HTML) 2 Page - Texas Instruments

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TMP275
SBOS363D − JUNE 2006 − REVISED AUGUST 2007
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply, V+
7.0V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage(2)
−0.5V to 7.0V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Current
10mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range
−55
°C to +127°C
. . . . . . . . . . . . . . .
Storage Temperature Range
−60
°C to +130°C
. . . . . . . . . . . . . . . . .
Junction Temperature (TJ max)
+150
°C
. . . . . . . . . . . . . . . . . . . . . .
ESD Rating:
Human Body Model (HBM)
4000V
. . . . . . . . . . . . . . . . . . . . . . .
Charged Device Model (CDM)
1000V
. . . . . . . . . . . . . . . . . . . .
Machine Model (MM)
300V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input voltage rating applies to all TMP275 input voltages.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
TMP275
MSOP-8
DGK
T275
TMP275
SO-8
D
TMP275
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.
PIN ASSIGNMENTS
Top View
NOTE: Pin 1 is determined by orienting the package as indicated in the diagram.
SDA
SCL
ALERT
GND
V+
A0
A1
A2
1
2
3
4
8
7
6
5
MSOP−8, SO−8


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