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LMZ12010 Folha de dados(PDF) 11 Page - Texas Instruments |
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LMZ12010 Folha de dados(HTML) 11 Page - Texas Instruments |
11 / 29 page 20 40 60 80 100 120 0 2 4 6 8 10 12 TEMPERATURE (C) JA = 9.9 °C/W JA = 6.8 °C/W JA = 5.2 °C/W 0 2 4 6 8 10 12 3 6 9 12 15 18 21 24 27 30 COPPER AREA (in 2 ) 2 Layer 0 LFPM 2 Layer 225 LFPM 4 Layer 0 LFPM 4 Layer 225 LFPM LMZ12010 www.ti.com SNVS667F – FEBRUARY 2010 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330 μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Thermal derating VIN = 12V, VOUT = 3.3V θJA vs copper heat sinking area Figure 36. Figure 37. Output ripple Output ripple 12VIN, 5.0VOUT @ Full Load, BW = 20 MHz 12VIN, 5.0VOUT@ Full Load, BW = 250 MHz Figure 38. Figure 39. Output ripple Output ripple 12VIN, 3.3VOUT @ Full Load, BW = 20 MHz 12VIN, 3.3VOUT@ Full Load, BW = 250 MHz Figure 40. Figure 41. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: LMZ12010 |
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