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AD-DPGIOZ Folha de dados(PDF) 8 Page - Analog Devices |
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8 / 61 page AD9961/AD9963 Data Sheet Rev. A | Page 8 of 60 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter With Respect to Rating RX33V, AUX33V RXGND −0.3 V to +3.9 V TXVDD TXGND −0.3 V to +3.9 V DRVDD DGND −0.3 V to +3.9 V CLK33V EPAD −0.3 V to +3.9 V RX18V, RX18VF RXGND −0.3 to +2.1 V DVDD18V EPAD −0.3 to +2.1 V CLK18V, DLL18V EPAD −0.3 to +2.1 V RXGND, TXGND, DGND, EPAD −0.3 V to +0.3 V TXIP, TXIN, TXQP, TXQN TXGND −1.0 V to TXVDD + 0.3 V RXIP, RXIN, RXQP, RXQN RXGND −0.3 V to RX18V + 0.3 V CS, SCLK, SDIO, RESET, LDO_EN DGND −0.3V to DRVDD + 0.3 V TRXD[11:0], TXD[11:0], TXIQ, TRXIQ, TXCLK, TRXCLK DGND −0.3 V to DRVDD + 0.3 V CLKP, CLKN EPAD −0.3 V to CLK33V + 0.3 V Junction Temperature +125°C Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 7. Thermal Resistance Airflow θ JA θ JB θ JC Unit 1 m/sec 17.1 10.6 1.0 °C/W 0 m/sec 20.3 °C/W Typical θJA, θJB, and θJC are specified for a JEDEC standard 51-7 High-κ thermal test board. Airflow increases heat dissipation, effectively reducing θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes, reduces the θJA. ESD CAUTION |
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