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ADM1275-2ARQZ-R7 Folha de dados(PDF) 8 Page - Analog Devices |
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ADM1275-2ARQZ-R7 Folha de dados(HTML) 8 Page - Analog Devices |
8 / 48 page ADM1275 Data Sheet Rev. D | Page 8 of 48 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VCC Pin −0.3 V to +25 V UV Pin −0.3 V to +4 V OV Pin −0.3 V to +4 V SS Pin −0.3 V to VCAP + 0.3 V TIMER Pin −0.3 V to VCAP + 0.3 V VCAP Pin −0.3 V to +4 V ISET Pin −0.3 V to VCAP + 0.3 V LATCH Pin −0.3 V to +25 V SCL Pin −0.3 V to +6.5 V SDA Pin −0.3 V to +6.5 V ADR Pin −0.3 V to VCAP + 0.3 V GPO1/ALERT1/CONV Pin, ENABLE Pin −0.3 V to +25 V GPO2/ALERT2 Pin −0.3 V to +25 V PWRGD Pin −0.3 V to +25 V FLB Pin −0.3 V to +25 V VOUT Pin −0.3 V to +25 V GATE Pin (Internal Supply Only)1 −0.3 V to +36 V SENSE+ Pin −0.3 V to +25 V SENSE− Pin −0.3 V to +25 V VSENSE (VSENSE+ − VSENSE−) ±0.3 V Continuous Current into Any Pin ±10 mA Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature, Soldering (10 sec) 300°C Junction Temperature 150°C 1 The GATE pin has internal clamping circuits to prevent the GATE pin voltage from exceeding the maximum ratings of a MOSFET with VGSMAX = 20 V and internal process limits. Applying a voltage source to this pin externally may cause irreversible damage. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL CHARACTERISTICS θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA Unit 16-lead QSOP (RQ-16) 150 °C/W 20-lead QSOP (RQ-20) 126 °C/W 20-lead LFCSP (CP-20-9) 30.4 °C/W ESD CAUTION |
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Descrição semelhante - ADM1275-2ARQZ-R7 |
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