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BCP68 Folha de dados(PDF) 6 Page - NXP Semiconductors

Nome de Peças BCP68
Descrição Electrónicos  20 V, 2 A NPN medium power transistors
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Fabricante Electrônico  PHILIPS [NXP Semiconductors]
Página de início  http://www.nxp.com
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BCP68 Folha de dados(HTML) 6 Page - NXP Semiconductors

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BCP68_BC868_BC68PA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 18 October 2011
6 of 23
NXP Semiconductors
BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4]
Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5]
Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
BCP68
[1] --
192
K/W
[2] --
125
K/W
[3] --
93
K/W
BC868
[1] --
250
K/W
[2] --
132
K/W
[3] --
93
K/W
BC68PA
[1] --
298
K/W
[2] --
151
K/W
[3] --
114
K/W
[4] --
154
K/W
[5] --
76
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
BCP68
-
-
16
K/W
BC868
-
-
16
K/W
BC68PA
-
-
20
K/W


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