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LMZ30606RKGR Folha de dados(PDF) 2 Page - Texas Instruments |
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LMZ30606RKGR Folha de dados(HTML) 2 Page - Texas Instruments |
2 / 25 page LMZ30606 SNVS995 – JULY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating temperature range (unless otherwise noted) VALUE UNIT MIN MAX VIN, PWRGD –0.3 7 V INH/UVLO, RT/CLK –0.3 3.3 V Input Voltage SS/TR, STSEL, VADJ –0.3 3 V SENSE+ VADJ rating must also be met -0.3 VOUT V PH –0.6 7 V Output Voltage PH 10 ns, transient –2 7 V VOUT -0.6 VIN V VDIFF (GND to exposed thermal pad) –0.2 0.2 V RT/CLK, INH/UVLO ±100 µA Source Current PH Current Limit A PH Current Limit A Sink Current SS/TR ±100 µA PWRGD 10 mA Operating Junction Temperature –40 125(2) °C Storage Temperature, Tstg –65 150 °C Mechanical Shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 1500 G Mechanical Vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20 (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) See the temperature derating curves in the Typical Characteristics section for thermal information. THERMAL INFORMATION LMZ30606 THERMAL METRIC(1) RKG39 UNIT 39 PINS θJA Junction-to-ambient thermal resistance(2) 12 ψJT Junction-to-top characterization parameter(3) 2.2 °C/W ψJB Junction-to-board characterization parameter(4) 9.7 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with 1 oz. copper and natural convection cooling. Additional airflow reduces θJA. (3) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device. (4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LMZ30606 |
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