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LMZ34002 Folha de dados(PDF) 4 Page - Texas Instruments

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Nome de Peças LMZ34002
Descrição Electrónicos  2A, Negative Output, SIMPLE SWITCHER짰 Power Module with 4.5V-40V Input in QFN Package
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
Logo TI1 - Texas Instruments

LMZ34002 Folha de dados(HTML) 4 Page - Texas Instruments

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VIN
VOUT
PH
GND
VADJ
STSEL
SS
LMZ34002
+
+
VREF
Comp
Power
Stage
and
Control
Logic
Thermal Shutdown
Shutdown
Logic
OCP
VIN
UVLO
OSC
w/PLL
A_VOUT
INH/UVLO
RT
CLK
LMZ34002
SNVS989A – JULY 2013 – REVISED SEPT 2013
www.ti.com
THERMAL INFORMATION
LMZ34002
THERMAL METRIC(1)
RKG
UNIT
41 PINS
θJA
Junction-to-ambient thermal resistance(2)
14
ψJT
Junction-to-top characterization parameter(3)
3.3
°C/W
ψJB
Junction-to-board characterization parameter(4)
6.8
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance,
θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with
1 oz. copper and natural convection cooling. Additional airflow reduces
θJA.
(3)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is
the temperature of the top of the device.
(4)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is
the temperature of the board 1mm from the device.
DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAM
4
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Product Folder Links: LMZ34002


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