Os motores de busca de Datasheet de Componentes eletrônicos
  Portuguese  ▼
ALLDATASHEETPT.COM

X  

MTV32N20E Folha de dados(PDF) 8 Page - Motorola, Inc

Nome de Peças MTV32N20E
Descrição Electrónicos  TMOS POWER FET 32 AMPERES 200 VOLTS RDS(on) = 0.075 OHM
Download  10 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrônico  MOTOROLA [Motorola, Inc]
Página de início  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MTV32N20E Folha de dados(HTML) 8 Page - Motorola, Inc

Back Button MTV32N20E Datasheet HTML 2Page - Motorola, Inc MTV32N20E Datasheet HTML 3Page - Motorola, Inc MTV32N20E Datasheet HTML 4Page - Motorola, Inc MTV32N20E Datasheet HTML 5Page - Motorola, Inc MTV32N20E Datasheet HTML 6Page - Motorola, Inc MTV32N20E Datasheet HTML 7Page - Motorola, Inc MTV32N20E Datasheet HTML 8Page - Motorola, Inc MTV32N20E Datasheet HTML 9Page - Motorola, Inc MTV32N20E Datasheet HTML 10Page - Motorola, Inc  
Zoom Inzoom in Zoom Outzoom out
 8 / 10 page
background image
MTV32N20E
8
Motorola TMOS Power MOSFET Transistor Device Data
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. Solder
stencils are used to screen the optimum amount. These
stencils are typically 0.008 inches thick and may be made of
brass or stainless steel. For packages such as the SC–59,
SC–70/SOT–323, SOD–123, SOT–23, SOT–143, SOT–223,
SO–8, SO–14, SO–16, and SMB/SMC diode packages, the
stencil opening should be the same as the pad size or a 1:1
registration. This is not the case with the DPAK and D2PAK
packages. If one uses a 1:1 opening to screen solder onto the
drain pad, misalignment and/or “tombstoning” may occur due
to an excess of solder. For these two packages, the opening
in the stencil for the paste should be approximately 50% of the
tab area. The opening for the leads is still a 1:1 registration.
Figure 16 shows a typical stencil for the DPAK and D2PAK
packages. The pattern of the opening in the stencil for the
drain pad is not critical as long as it allows approximately 50%
of the pad to be covered with paste.
Figure 16. Typical Stencil for DPAK and
D2PAK Packages
SOLDER PASTE
OPENINGS
STENCIL
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and soldering
should be 100
°C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10
°C.
The soldering temperature and time shall not exceed
260
°C for more than 10 seconds.
When shifting from preheating to soldering, the maximum
temperature gradient shall be 5
°C or less.
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
* Due to shadowing and the inability to set the wave height to
incorporate other surface mount components, the D2PAK is
not recommended for wave soldering.


Nº de peça semelhante - MTV32N20E

Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
logo
Inchange Semiconductor ...
MTV32N20E ISC-MTV32N20E Datasheet
298Kb / 2P
   isc N-Channel MOSFET Transistor
More results

Descrição semelhante - MTV32N20E

Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
logo
Motorola, Inc
MTW32N20E MOTOROLA-MTW32N20E Datasheet
205Kb / 8P
   TMOS POWER FET 32 AMPERES 200 VOLTS RDS(on) = 0.075 OHM
MTD6N20E MOTOROLA-MTD6N20E Datasheet
269Kb / 10P
   TMOS POWER FET 6.0 AMPERES 200 VOLTS RDS(on) = 0.7 OHM
MTD4N20E MOTOROLA-MTD4N20E Datasheet
268Kb / 10P
   TMOS POWER FET 4.0 AMPERES 200 VOLTS RDS(on) = 1.2 OHM
MTP36N06V MOTOROLA-MTP36N06V Datasheet
188Kb / 8P
   TMOS POWER FET 32 AMPERES 60 VOLTS RDS(on) = 0.04 OHM
MTW32N25E MOTOROLA-MTW32N25E Datasheet
151Kb / 8P
   TMOS POWER FET 32 AMPERES 250 VOLTS RDS(on) = 0.08 OHM
MTP20N20E MOTOROLA-MTP20N20E Datasheet
203Kb / 8P
   TMOS POWER FET 20 AMPERES 200 VOLTS RDS(on) = 0.16 OHM
MTY55N20E MOTOROLA-MTY55N20E Datasheet
231Kb / 8P
   TMOS POWER FET 55 AMPERES 200 VOLTS RDS(on) = 0.028 OHM
MTE125N20E MOTOROLA-MTE125N20E Datasheet
228Kb / 8P
   TMOS POWER FET 125 AMPERES 200 VOLTS RDS(on) = 0.015 OHM
MTP6P20E MOTOROLA-MTP6P20E Datasheet
216Kb / 8P
   TMOS POWER FET 6.0 AMPERES 200 VOLTS RDS(on) = 1.0 OHM
MTP7N20E MOTOROLA-MTP7N20E Datasheet
223Kb / 8P
   TMOS POWER FET 7.0 AMPERES 200 VOLTS RDS(on) = 0.70 OHMS
More results


Html Pages

1 2 3 4 5 6 7 8 9 10


Folha de dados Download

Go To PDF Page


Ligação URL




Privacy Policy
ALLDATASHEETPT.COM
ALLDATASHEET é útil para você?  [ DONATE ] 

Sobre Alldatasheet   |   Publicidade   |   Contato conosco   |   Privacy Policy   |   roca de Link   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com